Recently along with the increasingly high integration of semiconductors, stricter cleanliness is required of wafer surfaces from the viewpoint of product yield. Consequently, the role of cleaning processes is becoming more and more important. Since the final washing of wafers of waters uses ultrapure water the cleanliness of wafers depends heavily on the quality of the ultrapure water. There fore, it is essential to improve the process lines used for the production of ultrapure water. We have an assortment of plastic piping materials that elute fewer metal ions and TOC and have finer inner surfaces. They fully accommodate the requirements of semiconductor manufacture, such as for 1MD-RAM, 4MD-RAM, and 16MDRAM. Ultrapure Water High Purity Series FEATURES . Minimized Leachable. . Mirror-smooth inner surfaces. . Dead space minimized to prevent residence of liquid. . Purified articles controlled under strict rules: degreasing and washing, forced drying with nitrogen, assembly, and packaging are carried out in a clean room. . Easy, dependable installation and removal. Easy to maintain and clean. . Unrivaled mechanical strength and reliabillity. 150