Introduction of resins for photoresists with a low metal content (below 100ppb.) and very high level of molecular weight control.
Overview
We manufacture resins for electronics materials (resins for photoresists) by applying our original phenolic resin synthesis technologies.
Our resins for photoresists are subjected to a very high level of molecular weight control and reduced a metal content to below 100ppb.
We can produce many various kinds of resins that meet customer’s needs for high precision with good reproducibility.
Forms
- Flake or block
Applications used mainly for
They are used mainly for photoresists for ICs, LCDs and printed wiring boards.
Features
- 1.Greatly advanced molecular weight control and high reproducibility:
In resists, an alkali solution is used as the developer and the alkali dissolution rate (ADR) is very important. We have elucidated: - （1）the relationship between the resin production method and the molecular weight, the ADR;
- （2）the relationship between differences in raw material composition and the molecular weight, the ADR.
This allows us to produce appropriate products that satisfy customer’s needs.
Our production equipment has adopted special improvements based on its expertise long nurtured in manufacturing so that it may perform resin production with very high reproducibility.
Its reproducibility level is within several percent of deviation from the target ADR. - 2.A low metal content
We implement strict control in all processes from acceptance of raw materials and product packaging to achieve low metal content.
The production equipment is so special that it is in a closed system to prevent metal contamination. In some locations, clean rooms have been installed as well.
Generally, We achieve an actual metal content far below 100 ppb with respect to sodium (Na), potassium (K), calcium (Ca), iron (Fe), chromium (Cr), nickel (Ni), aluminum (Al), copper (Cu) and other elements.
For inquiry on this product
- Contact us and/or request materials online
